AS7C181024LL-55TI vs SLC9-65608V-55MHXXX:D feature comparison

AS7C181024LL-55TI Alliance Semiconductor Corporation

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SLC9-65608V-55MHXXX:D Temic Semiconductors

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ALLIANCE SEMICONDUCTOR CORP TEMIC SEMICONDUCTORS
Part Package Code TSOP1
Package Description SOP, TSSOP32,.8,20
Pin Count 32
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.32.00.41
Access Time-Max 55 ns 55 ns
I/O Type COMMON
JESD-30 Code R-PDSO-G32 R-CDIP-T32
JESD-609 Code e0
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 128KX8 128KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code SOP DIP
Package Equivalence Code TSSOP32,.8,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240
Qualification Status Not Qualified Not Qualified
Standby Current-Max 4e-7 A
Standby Voltage-Min 1.2 V 2 V
Supply Current-Max 0.019 mA
Supply Voltage-Max (Vsup) 1.95 V 3.6 V
Supply Voltage-Min (Vsup) 1.65 V 3 V
Supply Voltage-Nom (Vsup) 1.8 V 3.3 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.5 mm
Terminal Position DUAL DUAL
Base Number Matches 1 1
Number of Ports 1
Output Enable YES
Screening Level MIL-STD-883 Class B (Modified)

Compare AS7C181024LL-55TI with alternatives

Compare SLC9-65608V-55MHXXX:D with alternatives