AS7C1024C-12JIN
vs
5962-3829407MYX
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ALLIANCE MEMORY INC
|
ELECTRONIC DESIGNS INC
|
| Part Package Code |
SOJ
|
|
| Package Description |
0.400 INCH, LEAD FREE, PLASTIC, SOJ-32
|
CERAMIC, LCC-32
|
| Pin Count |
32
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.B.2.B
|
|
| HTS Code |
8542.32.00.41
|
|
| Factory Lead Time |
52 Weeks
|
|
| Samacsys Manufacturer |
Alliance Memory
|
|
| Access Time-Max |
12 ns
|
70 ns
|
| JESD-30 Code |
R-PDSO-J32
|
R-CQCC-N32
|
| Length |
20.955 mm
|
|
| Memory Density |
1048576 bit
|
65536 bit
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
8
|
8
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
32
|
| Number of Words |
131072 words
|
8192 words
|
| Number of Words Code |
128000
|
8000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Organization |
128KX8
|
8KX8
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
SOJ
|
QCCN
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
CHIP CARRIER
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
245
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.7 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Form |
J BEND
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
10.16 mm
|
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare AS7C1024C-12JIN with alternatives
Compare 5962-3829407MYX with alternatives