AS6C4008-55BIN vs NMS64X8EVM30 feature comparison

AS6C4008-55BIN Alliance Memory Inc

Buy Now Datasheet

NMS64X8EVM30 Texas Instruments

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ALLIANCE MEMORY INC NATIONAL SEMICONDUCTOR CORP
Part Package Code BGA SOJ
Package Description TFBGA, BGA36,6X8,30 SOJ,
Pin Count 36 28
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.2.A EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Factory Lead Time 16 Weeks
Samacsys Manufacturer Alliance Memory
Access Time-Max 55 ns 30 ns
I/O Type COMMON
JESD-30 Code R-PBGA-B36 R-PDSO-J28
Length 8 mm 17.907 mm
Memory Density 4194304 bit 65536 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 36 28
Number of Words 524288 words 8192 words
Number of Words Code 512000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 512KX8 8KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA SOJ
Package Equivalence Code BGA36,6X8,30
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 3.683 mm
Standby Current-Max 0.00003 A
Standby Voltage-Min 2 V
Supply Current-Max 0.06 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2.7 V 3 V
Supply Voltage-Nom (Vsup) 3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form BALL J BEND
Terminal Pitch 0.75 mm 1.27 mm
Terminal Position BOTTOM DUAL
Width 6 mm 7.5 mm
Base Number Matches 2 1
Number of Ports 1
Output Enable YES

Compare AS6C4008-55BIN with alternatives

Compare NMS64X8EVM30 with alternatives