AS6C4008-55BIN vs AS6C4008-55TIN feature comparison

AS6C4008-55BIN Alliance Memory Inc

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AS6C4008-55TIN Alliance Memory Inc

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer ALLIANCE MEMORY INC ALLIANCE MEMORY INC
Part Package Code BGA TSOP1
Package Description TFBGA, BGA36,6X8,30 TSOP1, TSSOP32,.8,20
Pin Count 36 32
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Factory Lead Time 16 Weeks 20 Weeks
Samacsys Manufacturer Alliance Memory Alliance Memory
Access Time-Max 55 ns 55 ns
I/O Type COMMON COMMON
JESD-30 Code R-PBGA-B36 R-PDSO-G32
Length 8 mm 18.4 mm
Memory Density 4194304 bit 4194304 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 36 32
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 512KX8 512KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TSOP1
Package Equivalence Code BGA36,6X8,30 TSSOP32,.8,20
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Standby Current-Max 0.00003 A 0.00003 A
Standby Voltage-Min 2 V 2 V
Supply Current-Max 0.06 mA 0.06 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL GULL WING
Terminal Pitch 0.75 mm 1.27 mm
Terminal Position BOTTOM DUAL
Width 6 mm 8 mm
Base Number Matches 2 2

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