AS6C1016-55BIN
vs
CY14B101NA-ZS20XCT
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ALLIANCE MEMORY INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
TSSOP
Package Description
TFBGA, BGA48,6X8,30
TSOP2,
Pin Count
48
44
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
3A991.B.2.B
HTS Code
8542.32.00.41
8542.32.00.41
Factory Lead Time
16 Weeks
Samacsys Manufacturer
Alliance Memory
Access Time-Max
55 ns
20 ns
I/O Type
COMMON
JESD-30 Code
R-PBGA-B48
R-PDSO-G44
Length
8 mm
18.415 mm
Memory Density
1048576 bit
1048576 bit
Memory IC Type
STANDARD SRAM
NON-VOLATILE SRAM
Memory Width
16
16
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
48
44
Number of Words
65536 words
65536 words
Number of Words Code
64000
64000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
64KX16
64KX16
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TSOP2
Package Equivalence Code
BGA48,6X8,30
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.194 mm
Standby Current-Max
0.00002 A
Standby Voltage-Min
2 V
Supply Current-Max
0.06 mA
Supply Voltage-Max (Vsup)
5.5 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
BALL
GULL WING
Terminal Pitch
0.75 mm
0.8 mm
Terminal Position
BOTTOM
DUAL
Width
6 mm
10.16 mm
Base Number Matches
1
1
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