AS6C1016-55BIN vs PDM41532SA20TATY feature comparison

AS6C1016-55BIN Alliance Memory Inc

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PDM41532SA20TATY IXYS Corporation

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ALLIANCE MEMORY INC IXYS CORP
Part Package Code BGA TSOP2
Package Description TFBGA, BGA48,6X8,30 TSOP2,
Pin Count 48 44
Reach Compliance Code compliant compliant
ECCN Code EAR99 3A991.B.2.B
HTS Code 8542.32.00.41 8542.32.00.41
Factory Lead Time 16 Weeks
Samacsys Manufacturer Alliance Memory
Access Time-Max 55 ns 20 ns
I/O Type COMMON
JESD-30 Code R-PBGA-B48 R-PDSO-G44
Length 8 mm 18.41 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16 16
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 48 44
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 105 °C
Operating Temperature-Min -40 °C -40 °C
Organization 64KX16 64KX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TSOP2
Package Equivalence Code BGA48,6X8,30
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Standby Current-Max 0.00002 A
Standby Voltage-Min 2 V
Supply Current-Max 0.06 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2.7 V 4.5 V
Supply Voltage-Nom (Vsup) 3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL GULL WING
Terminal Pitch 0.75 mm 0.8 mm
Terminal Position BOTTOM DUAL
Width 6 mm 10.16 mm
Base Number Matches 2 1
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare PDM41532SA20TATY with alternatives