AS6C1008-55BIN
vs
AS6C1008-55PIN
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ALLIANCE MEMORY INC
|
ALLIANCE MEMORY INC
|
| Part Package Code |
BGA
|
DIP
|
| Pin Count |
36
|
32
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Factory Lead Time |
16 Weeks
|
16 Weeks
|
| Samacsys Manufacturer |
Alliance Memory
|
Alliance Memory
|
| Access Time-Max |
55 ns
|
55 ns
|
| I/O Type |
COMMON
|
|
| JESD-30 Code |
R-PBGA-B36
|
R-PDIP-T32
|
| Length |
8 mm
|
41.91 mm
|
| Memory Density |
1048576 bit
|
1048576 bit
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
8
|
8
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
36
|
32
|
| Number of Words |
131072 words
|
131072 words
|
| Number of Words Code |
128000
|
128000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
128KX8
|
128KX8
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFBGA
|
DIP
|
| Package Equivalence Code |
BGA36,6X8,30
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
IN-LINE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
3.937 mm
|
| Standby Current-Max |
0.000003 A
|
|
| Standby Voltage-Min |
1.5 V
|
|
| Supply Current-Max |
0.06 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
THROUGH-HOLE
|
| Terminal Pitch |
0.75 mm
|
2.54 mm
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Width |
6 mm
|
15.24 mm
|
| Base Number Matches |
2
|
1
|
| JESD-609 Code |
|
e3/e6
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Terminal Finish |
|
PURE MATTE TIN/TIN BISMUTH
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare AS6C1008-55BIN with alternatives
Compare AS6C1008-55PIN with alternatives