AS4SD2M32DGX-6XT vs K4S643232E-TN600 feature comparison

AS4SD2M32DGX-6XT Micross Components

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K4S643232E-TN600 Samsung Semiconductor

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer AUSTIN SEMICONDUCTOR INC SAMSUNG SEMICONDUCTOR INC
Part Package Code TSOP2 TSOP2
Package Description TSOP2, TSOP2,
Pin Count 86 86
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.02 8542.32.00.02
Access Mode FOUR BANK PAGE BURST FOUR BANK PAGE BURST
Access Time-Max 5.5 ns 5.5 ns
Additional Feature AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 Code R-PDSO-G86 R-PDSO-G86
Length 22.22 mm 22.22 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type SYNCHRONOUS DRAM SYNCHRONOUS DRAM
Memory Width 32 32
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 86 86
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -25 °C
Organization 2MX32 2MX32
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP2 TSOP2
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Self Refresh YES YES
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY OTHER
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 0.5 mm
Terminal Position DUAL DUAL
Width 10.16 mm 10.16 mm
Base Number Matches 1 1
Rohs Code No
Peak Reflow Temperature (Cel) 240
Time@Peak Reflow Temperature-Max (s) 30

Compare AS4SD2M32DGX-6XT with alternatives

Compare K4S643232E-TN600 with alternatives