AS4C4M32D1A-5BIN
vs
EDD1232ACBH-6B-F
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ALLIANCE MEMORY INC
ELPIDA MEMORY INC
Package Description
FBGA-144
TFBGA,
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.02
8542.32.00.02
Factory Lead Time
20 Weeks
Samacsys Manufacturer
Alliance Memory
Access Mode
FOUR BANK PAGE BURST
FOUR BANK PAGE BURST
Access Time-Max
0.7 ns
0.7 ns
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
Clock Frequency-Max (fCLK)
200 MHz
I/O Type
COMMON
Interleaved Burst Length
2,4,8
JESD-30 Code
S-PBGA-B144
S-PBGA-B144
Length
12 mm
10.5 mm
Memory Density
134217728 bit
134217728 bit
Memory IC Type
DDR1 DRAM
DDR DRAM
Memory Width
32
32
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
144
144
Number of Words
4194304 words
4194304 words
Number of Words Code
4000000
4000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
4MX32
4MX32
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
TFBGA
Package Equivalence Code
BGA144,12X12,32
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Refresh Cycles
4096
Seated Height-Max
1.4 mm
1.2 mm
Self Refresh
YES
YES
Sequential Burst Length
2,4,8
Standby Current-Max
0.075 A
Standby Voltage-Min
2.3 V
Supply Current-Max
0.57 mA
Supply Voltage-Max (Vsup)
2.7 V
2.7 V
Supply Voltage-Min (Vsup)
2.3 V
2.3 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
12 mm
10.5 mm
Base Number Matches
1
1
Part Package Code
BGA
Pin Count
144
JESD-609 Code
e1
Terminal Finish
TIN SILVER COPPER
Compare AS4C4M32D1A-5BIN with alternatives
Compare EDD1232ACBH-6B-F with alternatives