AS27C256A-20JM/MIL
vs
NM27LC256NE200
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROSS COMPONENTS
NATIONAL SEMICONDUCTOR CORP
Part Package Code
DIP
DIP
Package Description
,
DIP,
Pin Count
28
28
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Base Number Matches
1
1
Access Time-Max
200 ns
JESD-30 Code
R-PDIP-T28
Length
35.725 mm
Memory Density
262144 bit
Memory IC Type
OTP ROM
Memory Width
8
Number of Functions
1
Number of Terminals
28
Number of Words
32768 words
Number of Words Code
32000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
32KX8
Package Body Material
PLASTIC/EPOXY
Package Code
DIP
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Seated Height-Max
5.334 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Width
15.24 mm
Compare AS27C256A-20JM/MIL with alternatives
Compare NM27LC256NE200 with alternatives