AQR109-B0-EG-Y
vs
VSC8664XIC-03
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Not Recommended
Ihs Manufacturer
MARVELL SEMICONDUCTOR INC
MICROCHIP TECHNOLOGY INC
Package Description
LFBGA,
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PBGA-B104
S-PBGA-B256
Length
11 mm
17 mm
Number of Functions
1
1
Number of Terminals
104
256
Operating Temperature-Max
108 °C
100 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
BGA
Package Shape
RECTANGULAR
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Seated Height-Max
1.57 mm
2 mm
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
Telecom IC Type
ETHERNET TRANSCEIVER
ETHERNET TRANSCEIVER
Temperature Grade
OTHER
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7 mm
17 mm
Base Number Matches
2
2
ECCN Code
5A991.B
Data Rate
1000000 Mbps
JESD-609 Code
e1
Number of Transceivers
4
Package Equivalence Code
BGA256,16X16,40
Terminal Finish
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Compare AQR109-B0-EG-Y with alternatives
Compare VSC8664XIC-03 with alternatives