AQR109-B0-EG-Y
vs
KSZ8563RNXV-TR-VAO
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
MARVELL SEMICONDUCTOR INC
MICROCHIP TECHNOLOGY INC
Package Description
LFBGA,
HVQCCN,
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PBGA-B104
S-PQCC-N64
Length
11 mm
8 mm
Number of Functions
1
1
Number of Terminals
104
64
Operating Temperature-Max
108 °C
105 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
HVQCCN
Package Shape
RECTANGULAR
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Seated Height-Max
1.57 mm
0.9 mm
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
Telecom IC Type
ETHERNET TRANSCEIVER
ETHERNET SWITCH
Temperature Grade
OTHER
INDUSTRIAL
Terminal Form
BALL
NO LEAD
Terminal Pitch
0.8 mm
0.4 mm
Terminal Position
BOTTOM
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7 mm
8 mm
Base Number Matches
2
1
Date Of Intro
2018-02-16
JESD-609 Code
e3
Package Equivalence Code
LCC64,.32SQ,16
Screening Level
AEC-Q100
Terminal Finish
Matte Tin (Sn) - annealed
Compare AQR109-B0-EG-Y with alternatives
Compare KSZ8563RNXV-TR-VAO with alternatives