AQR108-B0-EG-Y
vs
KSZ8563RNXV-VAO
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MARVELL SEMICONDUCTOR INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
LFBGA,
|
HVQCCN,
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
R-PBGA-B104
|
S-PQCC-N64
|
| Length |
11 mm
|
8 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
104
|
64
|
| Operating Temperature-Max |
108 °C
|
105 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFBGA
|
HVQCCN
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Seated Height-Max |
1.57 mm
|
0.9 mm
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET SWITCH
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
NO LEAD
|
| Terminal Pitch |
0.8 mm
|
0.4 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
7 mm
|
8 mm
|
| Base Number Matches |
2
|
1
|
| Date Of Intro |
|
2018-02-16
|
| JESD-609 Code |
|
e3
|
| Package Equivalence Code |
|
LCC64,.32SQ,16
|
| Screening Level |
|
AEC-Q100
|
| Terminal Finish |
|
Matte Tin (Sn) - annealed
|
|
|
|
Compare AQR108-B0-EG-Y with alternatives
Compare KSZ8563RNXV-VAO with alternatives