AQR108-B0-EG-Y
vs
VSC8531XMW-01
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
AQUANTIA CORP
|
MICROSEMI CORP
|
Package Description |
LFBGA,
|
HVQCCN,
|
Reach Compliance Code |
unknown
|
compliant
|
JESD-30 Code |
R-PBGA-B104
|
S-PQCC-N48
|
Length |
11 mm
|
6 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
104
|
48
|
Operating Temperature-Max |
108 °C
|
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
HVQCCN
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Seated Height-Max |
1.57 mm
|
0.9 mm
|
Supply Voltage-Nom |
1.2 V
|
1 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
|
Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
Temperature Grade |
OTHER
|
|
Terminal Form |
BALL
|
NO LEAD
|
Terminal Pitch |
0.8 mm
|
0.4 mm
|
Terminal Position |
BOTTOM
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
7 mm
|
6 mm
|
Base Number Matches |
2
|
2
|
HTS Code |
|
8542.39.00.01
|
Samacsys Manufacturer |
|
Microsemi Corporation
|
|
|
|
Compare AQR108-B0-EG-Y with alternatives
Compare VSC8531XMW-01 with alternatives