APTGT600SK60G
vs
BSM75GB60DLCHOSA1
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
INFINEON TECHNOLOGIES AG
|
| Package Description |
ROHS COMPLIANT, SP6, 5 PIN
|
FLANGE MOUNT, R-XUFM-X7
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Factory Lead Time |
27 Weeks
|
4 Weeks
|
| Additional Feature |
AVALANCHE RATED
|
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Collector Current-Max (IC) |
500 A
|
100 A
|
| Collector-Emitter Voltage-Max |
600 V
|
600 V
|
| Configuration |
SINGLE WITH BUILT-IN DIODE
|
SERIES, 2 ELEMENTS WITH BUILT-IN DIODE
|
| JESD-30 Code |
R-XUFM-X5
|
R-XUFM-X7
|
| JESD-609 Code |
e1
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Elements |
1
|
2
|
| Number of Terminals |
5
|
7
|
| Operating Temperature-Max |
175 °C
|
150 °C
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
| Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
NO
|
| Terminal Finish |
TIN SILVER COPPER
|
|
| Terminal Form |
UNSPECIFIED
|
UNSPECIFIED
|
| Terminal Position |
UPPER
|
UPPER
|
| Transistor Application |
POWER CONTROL
|
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Turn-off Time-Nom (toff) |
400 ns
|
205 ns
|
| Turn-on Time-Nom (ton) |
205 ns
|
90 ns
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
| Part Package Code |
|
MODULE
|
| Pin Count |
|
7
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare APTGT600SK60G with alternatives
Compare BSM75GB60DLCHOSA1 with alternatives