APT75F50B2
vs
IXFB72N55Q2
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MICROSEMI CORP
|
IXYS CORP
|
| Part Package Code |
TO-247AB
|
|
| Package Description |
ROHS COMPLIANT, T-MAX, 3 PIN
|
PLUS264, 3 PIN
|
| Pin Count |
3
|
3
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Samacsys Manufacturer |
Microsemi Corporation
|
|
| Additional Feature |
AVALANCHE RATED, HIGH RELIABILITY
|
AVALANCHE RATED
|
| Avalanche Energy Rating (Eas) |
1580 mJ
|
5000 mJ
|
| Case Connection |
DRAIN
|
DRAIN
|
| Configuration |
SINGLE WITH BUILT-IN DIODE
|
SINGLE WITH BUILT-IN DIODE
|
| DS Breakdown Voltage-Min |
500 V
|
550 V
|
| Drain Current-Max (ID) |
75 A
|
72 A
|
| Drain-source On Resistance-Max |
0.075 Ω
|
0.072 Ω
|
| FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
| JEDEC-95 Code |
TO-247AB
|
|
| JESD-30 Code |
R-PSIP-T3
|
R-PSIP-T3
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
3
|
3
|
| Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
| Power Dissipation-Max (Abs) |
1040 W
|
|
| Pulsed Drain Current-Max (IDM) |
230 A
|
284 A
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
NO
|
| Terminal Finish |
PURE MATTE TIN
|
TIN SILVER COPPER
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
SINGLE
|
SINGLE
|
| Transistor Application |
SWITCHING
|
SWITCHING
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Base Number Matches |
1
|
1
|
| JESD-609 Code |
|
e1
|
|
|
|
Compare APT75F50B2 with alternatives
Compare IXFB72N55Q2 with alternatives