Findchips: Compare APA600-FGG256 vs APA600-FG256I

APA600-FGG256 vs APA600-FG256I feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes	No
Part Life Cycle Code	Transferred	Transferred
Ihs Manufacturer	MICROSEMI CORP	MICROSEMI CORP
Package Description	BGA, BGA256,16X16,40	BGA, BGA256,16X16,40
Reach Compliance Code	compliant	unknown
HTS Code	8542.39.00.01	8542.39.00.01
Clock Frequency-Max	180 MHz	180 MHz
JESD-30 Code	S-PBGA-B256	S-PBGA-B256
JESD-609 Code	e1	e0
Length	17 mm	17 mm
Moisture Sensitivity Level	3	3
Number of Equivalent Gates	600000	600000
Number of Inputs	186	186
Number of Logic Cells	21504	21504
Number of Outputs	186	186
Number of Terminals	256	256
Operating Temperature-Max	70 °C	85 °C
Operating Temperature-Min		-40 °C
Organization	600000 GATES	600000 GATES
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	BGA
Package Equivalence Code	BGA256,16X16,40	BGA256,16X16,40
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Cel)	250	225
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	1.8 mm	1.8 mm
Supply Voltage-Max	2.7 V	2.7 V
Supply Voltage-Min	2.3 V	2.3 V
Supply Voltage-Nom	2.5 V	2.5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	COMMERCIAL	INDUSTRIAL
Terminal Finish	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Lead (Sn/Pb)
Terminal Form	BALL	BALL
Terminal Pitch	1 mm	1 mm
Terminal Position	BOTTOM	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30	20
Width	17 mm	17 mm
Base Number Matches	7	3
Samacsys Manufacturer		Microsemi Corporation
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays