APA600-FGG256
vs
APA600-FGG256I
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
ACTEL CORP
Package Description
1 MM PITCH, ROHS COMPLIANT, FBGA-256
1 MM PITCH, ROHS COMPLIANT, FBGA-256
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
Factory Lead Time
18 Weeks
Clock Frequency-Max
180 MHz
180 MHz
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e1
e1
Length
17 mm
17 mm
Moisture Sensitivity Level
3
3
Number of Equivalent Gates
600000
600000
Number of Inputs
186
186
Number of Logic Cells
21504
21504
Number of Outputs
186
186
Number of Terminals
256
256
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
600000 GATES
600000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA256,16X16,40
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Packing Method
TRAY
Peak Reflow Temperature (Cel)
250
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.8 mm
1.8 mm
Supply Voltage-Max
2.7 V
2.7 V
Supply Voltage-Min
2.3 V
2.3 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
17 mm
17 mm
Base Number Matches
3
3
Compare APA600-FGG256 with alternatives