Findchips: Compare APA600-BGG456B vs APA600-BG456

APA600-BGG456B vs APA600-BG456 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes	No
Part Life Cycle Code	Transferred	Transferred
Ihs Manufacturer	MICROSEMI CORP	MICROSEMI CORP
Package Description	BGA,	BGA, BGA456,26X26,50
Reach Compliance Code	compliant	unknown
ECCN Code	3A001.A.2.C
HTS Code	8542.39.00.01	8542.39.00.01
JESD-30 Code	S-PBGA-B456	S-PBGA-B456
JESD-609 Code	e1
Length	35 mm	35 mm
Moisture Sensitivity Level	3	3
Number of Equivalent Gates	600000	600000
Number of Terminals	456	456
Operating Temperature-Max	125 °C	70 °C
Operating Temperature-Min	-55 °C
Organization	600000 GATES	600000 GATES
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	BGA
Package Equivalence Code	BGA456,26X26,50	BGA456,26X26,50
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Not Qualified
Screening Level	MIL-STD-883 Class B
Seated Height-Max	2.54 mm	2.54 mm
Supply Voltage-Max	2.7 V	2.7 V
Supply Voltage-Min	2.3 V	2.3 V
Supply Voltage-Nom	2.5 V	2.5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	MILITARY	COMMERCIAL
Terminal Finish	TIN SILVER COPPER
Terminal Form	BALL	BALL
Terminal Pitch	1.27 mm	1.27 mm
Terminal Position	BOTTOM	BOTTOM
Width	35 mm	35 mm
Base Number Matches	3	3
Samacsys Manufacturer		Microsemi Corporation
Clock Frequency-Max		180 MHz
Number of Inputs		356
Number of Logic Cells		21504
Number of Outputs		356
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays