Findchips: Compare APA450-BG456 vs APA450-BG456I

APA450-BG456 vs APA450-BG456I feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	No	No
Part Life Cycle Code	Transferred	Active
Ihs Manufacturer	MICROSEMI CORP	MICROCHIP TECHNOLOGY INC
Package Description	BGA, BGA456,26X26,50	1.27 MM PITCH, PLASTIC, BGA-456
Reach Compliance Code	unknown	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Clock Frequency-Max	180 MHz	180 MHz
JESD-30 Code	S-PBGA-B456	S-PBGA-B456
Length	35 mm	35 mm
Moisture Sensitivity Level	3	3
Number of Equivalent Gates	450000	450000
Number of Inputs	344	344
Number of Logic Cells	12288	12288
Number of Outputs	344	344
Number of Terminals	456	456
Operating Temperature-Max	70 °C	85 °C
Operating Temperature-Min		-40 °C
Organization	450000 GATES	450000 GATES
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	BGA
Package Equivalence Code	BGA456,26X26,50	BGA456,26X26,50
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	2.54 mm	2.54 mm
Supply Voltage-Max	2.7 V	2.7 V
Supply Voltage-Min	2.3 V	2.3 V
Supply Voltage-Nom	2.5 V	2.5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	COMMERCIAL	INDUSTRIAL
Terminal Form	BALL	BALL
Terminal Pitch	1.27 mm	1.27 mm
Terminal Position	BOTTOM	BOTTOM
Width	35 mm	35 mm
Base Number Matches	8	3
Factory Lead Time		18 Weeks
JESD-609 Code		e0
Peak Reflow Temperature (Cel)		225
Terminal Finish		TIN LEAD
Time@Peak Reflow Temperature-Max (s)		20
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays