APA450-BG456I vs APA450-BGG456I feature comparison

APA450-BG456I Microsemi Corporation

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APA450-BGG456I Actel Corporation

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Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP ACTEL CORP
Package Description BGA, BGA456,26X26,50 1.27 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-456
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01
Clock Frequency-Max 180 MHz 180 MHz
JESD-30 Code S-PBGA-B456 S-PBGA-B456
JESD-609 Code e0 e1
Length 35 mm 35 mm
Moisture Sensitivity Level 3 3
Number of Equivalent Gates 450000 450000
Number of Inputs 344 344
Number of Logic Cells 12288 12288
Number of Outputs 344 344
Number of Terminals 456 456
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 450000 GATES 450000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA456,26X26,50 BGA456,26X26,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.54 mm 2.54 mm
Supply Voltage-Max 2.7 V 2.7 V
Supply Voltage-Min 2.3 V 2.3 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 35 mm 35 mm
Base Number Matches 3 3

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