APA300-BG456M vs APA300-BG456I feature comparison

APA300-BG456M Microsemi Corporation

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APA300-BG456I Microchip Technology Inc

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Rohs Code No No
Part Life Cycle Code Transferred Active
Ihs Manufacturer MICROSEMI CORP MICROCHIP TECHNOLOGY INC
Package Description BGA, BGA456,26X26,50 1.27 MM PITCH, PLASTIC, BGA-456
Reach Compliance Code unknown compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Microsemi Corporation Microchip
Clock Frequency-Max 180 MHz 180 MHz
JESD-30 Code S-PBGA-B456 S-PBGA-B456
JESD-609 Code e0 e0
Length 35 mm 35 mm
Moisture Sensitivity Level 3 3
Number of Equivalent Gates 300000 300000
Number of Inputs 290 290
Number of Logic Cells 8192 8192
Number of Outputs 290 290
Number of Terminals 456 456
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Organization 300000 GATES 300000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA456,26X26,50 BGA456,26X26,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.54 mm 2.54 mm
Supply Voltage-Max 2.7 V 2.7 V
Supply Voltage-Min 2.3 V 2.3 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 35 mm 35 mm
Base Number Matches 2 2
Factory Lead Time 26 Weeks
Packing Method TRAY
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 20

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