APA300-BG456I
vs
APA300-FBG456
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
ACTEL CORP
|
MICROSEMI CORP
|
| Package Description |
1.27 MM PITCH, PLASTIC, BGA-456
|
BGA, BGA456,26X26,50
|
| Reach Compliance Code |
compliant
|
unknown
|
| Clock Frequency-Max |
180 MHz
|
180 MHz
|
| JESD-30 Code |
S-PBGA-B456
|
S-PBGA-B456
|
| JESD-609 Code |
e0
|
|
| Length |
35 mm
|
35 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Equivalent Gates |
300000
|
300000
|
| Number of Inputs |
290
|
290
|
| Number of Logic Cells |
8192
|
8192
|
| Number of Outputs |
290
|
290
|
| Number of Terminals |
456
|
456
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
300000 GATES
|
300000 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA456,26X26,50
|
BGA456,26X26,50
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.54 mm
|
2.54 mm
|
| Supply Voltage-Max |
2.7 V
|
2.7 V
|
| Supply Voltage-Min |
2.3 V
|
2.3 V
|
| Supply Voltage-Nom |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
35 mm
|
35 mm
|
| Base Number Matches |
3
|
3
|
| HTS Code |
|
8542.39.00.01
|
|
|
|
Compare APA300-FBG456 with alternatives