AMPAL16L8APC
vs
PAL16R6-10LMB
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
CYPRESS SEMICONDUCTOR CORP
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Programmable Logic Type |
OT PLD
|
OT PLD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Base Number Matches |
2
|
1
|
| Part Package Code |
|
QLCC
|
| Package Description |
|
QCCN, LCC20,.35SQ
|
| Pin Count |
|
20
|
| ECCN Code |
|
3A001.A.2.C
|
| Additional Feature |
|
POWER-UP RESET
|
| Architecture |
|
PAL-TYPE
|
| Clock Frequency-Max |
|
87 MHz
|
| JESD-30 Code |
|
S-CQCC-N20
|
| JESD-609 Code |
|
e0
|
| Length |
|
8.89 mm
|
| Number of Dedicated Inputs |
|
8
|
| Number of I/O Lines |
|
2
|
| Number of Inputs |
|
10
|
| Number of Outputs |
|
6
|
| Number of Product Terms |
|
64
|
| Number of Terminals |
|
20
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Organization |
|
8 DEDICATED INPUTS, 2 I/O
|
| Output Function |
|
MIXED
|
| Package Body Material |
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
|
QCCN
|
| Package Equivalence Code |
|
LCC20,.35SQ
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
CHIP CARRIER
|
| Propagation Delay |
|
10 ns
|
| Qualification Status |
|
Not Qualified
|
| Screening Level |
|
38535Q/M;38534H;883B
|
| Seated Height-Max |
|
1.905 mm
|
| Supply Voltage-Max |
|
5.5 V
|
| Supply Voltage-Min |
|
4.5 V
|
| Supply Voltage-Nom |
|
5 V
|
| Surface Mount |
|
YES
|
| Technology |
|
BICMOS
|
| Temperature Grade |
|
MILITARY
|
| Terminal Finish |
|
TIN LEAD
|
| Terminal Form |
|
NO LEAD
|
| Terminal Pitch |
|
1.27 mm
|
| Terminal Position |
|
QUAD
|
| Width |
|
8.89 mm
|
|
|
|
Compare AMPAL16L8APC with alternatives
Compare PAL16R6-10LMB with alternatives