AM99C165-55LCB
vs
GVT73024UL8TSB-55I
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
CYPRESS SEMICONDUCTOR CORP
Package Description
QCCN, LCC28,.35X.55
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
55 ns
55 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-XQCC-N28
R-PDSO-G32
JESD-609 Code
e0
e0
Memory Density
65536 bit
1048576 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
4
8
Number of Terminals
28
32
Number of Words
16384 words
131072 words
Number of Words Code
16000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
16KX4
128KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC
PLASTIC/EPOXY
Package Code
QCCN
TSSOP
Package Equivalence Code
LCC28,.35X.55
TSSOP32,.8,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial
PARALLEL
PARALLEL
Standby Current-Max
0.015 A
0.000005 A
Standby Voltage-Min
4.5 V
1.5 V
Supply Current-Max
0.11 mA
0.05 mA
Supply Voltage-Nom (Vsup)
5 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
1.27 mm
0.5 mm
Terminal Position
QUAD
DUAL
Base Number Matches
1
1
Pbfree Code
Qualification Status
Not Qualified
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