AM91L11BPC
vs
HM1-6561-8
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
INTERSIL CORP
Part Package Code
DIP
Package Description
DIP, DIP18,.3
Pin Count
18
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
400 ns
300 ns
I/O Type
COMMON
JESD-30 Code
R-PDIP-T18
R-XDIP-T18
JESD-609 Code
e0
e0
Memory Density
1024 bit
1024 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
4
4
Number of Functions
1
Number of Ports
1
Number of Terminals
18
18
Number of Words
256 words
256 words
Number of Words Code
256
256
Operating Mode
ASYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
256X4
256X4
Output Characteristics
3-STATE
3-STATE
Output Enable
NO
Package Body Material
PLASTIC/EPOXY
CERAMIC
Package Code
DIP
DIP
Package Equivalence Code
DIP18,.3
DIP18,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
NO
Technology
MOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
1
3
Screening Level
38535Q/M;38534H;883B
Standby Current-Max
0.00001 A
Standby Voltage-Min
2 V
Supply Current-Max
0.006 mA
Terminal Pitch
2.54 mm
Compare AM91L11BPC with alternatives
Compare HM1-6561-8 with alternatives