AM9147-70DC vs MBM2147EC feature comparison

AM9147-70DC AMD

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MBM2147EC FUJITSU Limited

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC FUJITSU LTD
Part Package Code DIP
Package Description DIP, DIP18,.3 DIP, DIP18,.3
Pin Count 18
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 70 ns 70 ns
I/O Type SEPARATE SEPARATE
JESD-30 Code R-CDIP-T18 R-XDIP-T18
JESD-609 Code e0 e0
Length 22.606 mm
Memory Density 4096 bit 4096 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 1 1
Number of Functions 1
Number of Ports 1
Number of Terminals 18 18
Number of Words 4096 words 4096 words
Number of Words Code 4000 4000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 4KX1 4KX1
Output Characteristics 3-STATE 3-STATE
Output Enable NO
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC
Package Code DIP DIP
Package Equivalence Code DIP18,.3 DIP18,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 Class C
Seated Height-Max 5.08 mm
Standby Voltage-Min 4.5 V 4.5 V
Supply Current-Max 0.16 mA 0.16 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology MOS MOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 4 1

Compare AM9147-70DC with alternatives

Compare MBM2147EC with alternatives