Part Details for MBM2147EC by FUJITSU Limited
Overview of MBM2147EC by FUJITSU Limited
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (6 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Part Details for MBM2147EC
MBM2147EC CAD Models
MBM2147EC Part Data Attributes
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MBM2147EC
FUJITSU Limited
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Datasheet
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MBM2147EC
FUJITSU Limited
Standard SRAM, 4KX1, 70ns, MOS, CDIP18,
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | FUJITSU LTD | |
| Package Description | DIP, DIP18,.3 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 70 ns | |
| I/O Type | SEPARATE | |
| JESD-30 Code | R-XDIP-T18 | |
| JESD-609 Code | e0 | |
| Memory Density | 4096 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 1 | |
| Number of Terminals | 18 | |
| Number of Words | 4096 words | |
| Number of Words Code | 4000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 4KX1 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC | |
| Package Code | DIP | |
| Package Equivalence Code | DIP18,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Standby Voltage-Min | 4.5 V | |
| Supply Current-Max | 0.16 mA | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | MOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL |
Alternate Parts for MBM2147EC
This table gives cross-reference parts and alternative options found for MBM2147EC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MBM2147EC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MBM2147EZ | IC,SRAM,4KX1,MOS,DIP,18PIN,CERAMIC | FUJITSU Semiconductor Limited | MBM2147EC vs MBM2147EZ |
| 5962-01-130-3405 | Standard SRAM, 4KX1, 70ns, MOS, CDIP18, | AMD | MBM2147EC vs 5962-01-130-3405 |
| MBM2147EZ | Standard SRAM, 4KX1, 70ns, MOS, CDIP18, | FUJITSU Limited | MBM2147EC vs MBM2147EZ |
| AM2147-70DC | Standard SRAM, 4KX1, 70ns, NMOS, CDIP18, CERAMIC, DIP-18 | AMD | MBM2147EC vs AM2147-70DC |
| AM9147-70DC | Standard SRAM, 4KX1, 70ns, MOS, CDIP18, 0.300 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-18 | AMD | MBM2147EC vs AM9147-70DC |
| MBM2147H-70Z | Standard SRAM, 4KX1, 70ns, MOS, CDIP18, | FUJITSU Limited | MBM2147EC vs MBM2147H-70Z |