AM9044BDC vs IDT6167LA25SO8 feature comparison

AM9044BDC AMD

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IDT6167LA25SO8 Integrated Device Technology Inc

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code DIP SOIC
Package Description DIP, DIP18,.3 SOP,
Pin Count 18 20
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 450 ns 25 ns
I/O Type SEPARATE
JESD-30 Code R-GDIP-T18 R-PDSO-G20
JESD-609 Code e0 e0
Length 22.86 mm 12.8 mm
Memory Density 4096 bit 16384 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 1 1
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 18 20
Number of Words 4096 words 16384 words
Number of Words Code 4000 16000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 4KX1 16KX1
Output Characteristics 3-STATE 3-STATE
Output Enable NO NO
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP18,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 2.65 mm
Standby Voltage-Min 4.5 V 2 V
Supply Current-Max 0.07 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology NMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.5 mm
Base Number Matches 4 1

Compare AM9044BDC with alternatives

Compare IDT6167LA25SO8 with alternatives