IDT6167LA25SO8
vs
MBM10470A-15CZ
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
FUJITSU SEMICONDUCTOR AMERICA INC
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOP,
|
DIP,
|
| Pin Count |
20
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
25 ns
|
15 ns
|
| JESD-30 Code |
R-PDSO-G20
|
R-GDIP-T18
|
| JESD-609 Code |
e0
|
|
| Length |
12.8 mm
|
22.78 mm
|
| Memory Density |
16384 bit
|
4096 bit
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Ports |
1
|
1
|
| Number of Terminals |
20
|
18
|
| Number of Words |
16384 words
|
4096 words
|
| Number of Words Code |
16000
|
4000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
75 °C
|
| Operating Temperature-Min |
|
|
| Organization |
16KX1
|
4KX1
|
| Output Characteristics |
3-STATE
|
OPEN-EMITTER
|
| Output Enable |
NO
|
NO
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
SOP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.65 mm
|
5.08 mm
|
| Standby Voltage-Min |
2 V
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
TTL
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.5 mm
|
7.62 mm
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare IDT6167LA25SO8 with alternatives
Compare MBM10470A-15CZ with alternatives