AM49DL322BGB70T
vs
MB84VD22184EH-70PBS
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
SPANSION INC
FUJITSU LTD
Part Package Code
BGA
BGA
Package Description
LFBGA,
TFBGA, BGA71,8X12,32
Pin Count
73
71
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Additional Feature
FLASH IS ALSO CONFIGURABLE AS 4M X 8; SRAM IS ORGANIZED AS 2M X 16
SRAM IS CONFIGURED AS 256K X 16/512K X 8
JESD-30 Code
R-PBGA-B73
R-PBGA-B71
JESD-609 Code
e0
e0
Length
11.6 mm
11 mm
Memory Density
33554432 bit
33554432 bit
Memory IC Type
MEMORY CIRCUIT
MEMORY CIRCUIT
Memory Width
16
16
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
73
71
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-25 °C
Organization
2MX16
2MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.3 V
3.3 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
8 mm
7 mm
Base Number Matches
2
2
Access Time-Max
70 ns
Mixed Memory Type
FLASH+SRAM
Package Equivalence Code
BGA71,8X12,32
Supply Current-Max
0.053 mA
Compare AM49DL322BGB70T with alternatives
Compare MB84VD22184EH-70PBS with alternatives