AM49DL322BGB70T vs MB84VD22184EH-70PBS feature comparison

AM49DL322BGB70T Spansion

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MB84VD22184EH-70PBS FUJITSU Limited

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Rohs Code No No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer SPANSION INC FUJITSU LTD
Part Package Code BGA BGA
Package Description LFBGA, TFBGA, BGA71,8X12,32
Pin Count 73 71
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Additional Feature FLASH IS ALSO CONFIGURABLE AS 4M X 8; SRAM IS ORGANIZED AS 2M X 16 SRAM IS CONFIGURED AS 256K X 16/512K X 8
JESD-30 Code R-PBGA-B73 R-PBGA-B71
JESD-609 Code e0 e0
Length 11.6 mm 11 mm
Memory Density 33554432 bit 33554432 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 73 71
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -25 °C
Organization 2MX16 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.3 V 3.3 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 8 mm 7 mm
Base Number Matches 2 2
Access Time-Max 70 ns
Mixed Memory Type FLASH+SRAM
Package Equivalence Code BGA71,8X12,32
Supply Current-Max 0.053 mA

Compare AM49DL322BGB70T with alternatives

Compare MB84VD22184EH-70PBS with alternatives