MB84VD22184EH-70PBS
vs
AM50DL9608GT85IS
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
FUJITSU LTD
SPANSION INC
Part Package Code
BGA
BGA
Package Description
TFBGA, BGA71,8X12,32
LFBGA,
Pin Count
71
73
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
70 ns
Additional Feature
SRAM IS CONFIGURED AS 256K X 16/512K X 8
SRAM IS ORGANISED AS 512K X 16 AND ALSO CONTAINS 2M X 16 FLASH
JESD-30 Code
R-PBGA-B71
R-PBGA-B73
JESD-609 Code
e0
e0
Length
11 mm
11.6 mm
Memory Density
33554432 bit
67108864 bit
Memory IC Type
MEMORY CIRCUIT
MEMORY CIRCUIT
Memory Width
16
16
Mixed Memory Type
FLASH+SRAM
Number of Functions
1
1
Number of Terminals
71
73
Number of Words
2097152 words
4194304 words
Number of Words Code
2000000
4000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-25 °C
-40 °C
Organization
2MX16
4MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
LFBGA
Package Equivalence Code
BGA71,8X12,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.4 mm
Supply Current-Max
0.053 mA
Supply Voltage-Max (Vsup)
3.3 V
3.3 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
7 mm
8 mm
Base Number Matches
2
2
Moisture Sensitivity Level
3
Compare MB84VD22184EH-70PBS with alternatives
Compare AM50DL9608GT85IS with alternatives