AM29LV800BB70SIB vs AM29LV800BB70SC feature comparison

AM29LV800BB70SIB Spansion

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AM29LV800BB70SC AMD

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Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SPANSION INC ADVANCED MICRO DEVICES INC
Part Package Code SOIC SOIC
Package Description MO-180AA, SOP-44 SOP,
Pin Count 44 44
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.32.00.51
Access Time-Max 70 ns 70 ns
Additional Feature CONFG AS 512K X 16; BOTTOM BOOT BLOCK CONFG AS 512K X 16; BOTTOM BOOT BLOCK
Alternate Memory Width 8 8
Boot Block BOTTOM
JESD-30 Code R-PDSO-G44 R-PDSO-G44
JESD-609 Code e0
Length 28.2 mm 28.2 mm
Memory Density 8388608 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 44 44
Number of Words 524288 words 1048576 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 512KX16 512KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.8 mm 2.8 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Type NOR TYPE
Width 13.3 mm 13.3 mm
Base Number Matches 2 2

Compare AM29LV800BB70SIB with alternatives

Compare AM29LV800BB70SC with alternatives