AM29LV640DU121RWHFN
vs
AM29LV640DU121RWHKN
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SPANSION INC
SPANSION INC
Part Package Code
BGA
BGA
Package Description
12 X 11 MM, 0.80 MM PITCH, LEAD FREE, FBGA-63
11 X 12 MM, 0.80 MM PITCH, FBGA-63
Pin Count
63
63
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
120 ns
120 ns
Boot Block
BOTTOM/TOP
BOTTOM/TOP
JESD-30 Code
R-PBGA-B63
R-PBGA-B63
JESD-609 Code
e1
e1
Length
12 mm
12 mm
Memory Density
67108864 bit
67108864 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
63
63
Number of Words
4194304 words
4194304 words
Number of Words Code
4000000
4000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Organization
4MX16
4MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Type
NOR TYPE
NOR TYPE
Width
11 mm
11 mm
Base Number Matches
1
1
Compare AM29LV640DU121RWHFN with alternatives
Compare AM29LV640DU121RWHKN with alternatives