AM29LV400BB-60RWJC1
vs
AM29LV400BB-70DWI1
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
SPANSION INC
Part Package Code
WAFER
WAFER
Package Description
WAFER-43
DIE, DIE OR CHIP
Pin Count
43
43
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
60 ns
70 ns
Alternate Memory Width
8
8
Boot Block
BOTTOM
BOTTOM
JESD-30 Code
R-XUUC-N43
R-XUUC-N43
Memory Density
4194304 bit
4194304 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
43
43
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
256KX16
256KX16
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIE
DIE
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
UNCASED CHIP
UNCASED CHIP
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
2.7 V
Supply Voltage-Nom (Vsup)
3.3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Position
UPPER
UPPER
Type
NOR TYPE
NOR TYPE
Base Number Matches
1
1
Rohs Code
Additional Feature
BOTTOM BOOT BLOCK
Command User Interface
YES
Data Polling
YES
Endurance
1000000 Write/Erase Cycles
JESD-609 Code
e0
Number of Sectors/Size
1,2,1,7
Package Equivalence Code
DIE OR CHIP
Ready/Busy
YES
Sector Size
16K,8K,32K,64K
Terminal Finish
TIN LEAD
Toggle Bit
YES
Compare AM29LV400BB-60RWJC1 with alternatives
Compare AM29LV400BB-70DWI1 with alternatives