AM29LV400BB-120WAD
vs
AM29LV400BT-120WAK
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
SPANSION INC
|
SPANSION INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
TFBGA,
|
TFBGA,
|
Pin Count |
48
|
48
|
Reach Compliance Code |
compliant
|
compliant
|
Access Time-Max |
120 ns
|
120 ns
|
Additional Feature |
CONFIGURABLE AS 256K X 16; EMBEDDED ALGORITHMS; 20 YEAR DATA RETENTION
|
CONFIGURABLE AS 256K X 16; EMBEDDED ALGORITHMS; 20 YEAR DATA RETENTION
|
JESD-30 Code |
R-PBGA-B48
|
R-PBGA-B48
|
JESD-609 Code |
e3
|
e3
|
Length |
8 mm
|
8 mm
|
Memory Density |
4194304 bit
|
4194304 bit
|
Memory IC Type |
FLASH
|
FLASH
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
48
|
48
|
Number of Words |
524288 words
|
524288 words
|
Number of Words Code |
512000
|
512000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Organization |
512KX8
|
512KX8
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TFBGA
|
TFBGA
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Programming Voltage |
3 V
|
3 V
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
MILITARY
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
Width |
6 mm
|
6 mm
|
Base Number Matches |
2
|
2
|
|
|
|
Compare AM29LV400BB-120WAD with alternatives
Compare AM29LV400BT-120WAK with alternatives