AM29LV400BT-120WAK
vs
AM29LV400B-120WAC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
SPANSION INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
Package Description
TFBGA,
,
Pin Count
48
Reach Compliance Code
compliant
compliant
Access Time-Max
120 ns
Additional Feature
CONFIGURABLE AS 256K X 16; EMBEDDED ALGORITHMS; 20 YEAR DATA RETENTION
JESD-30 Code
R-PBGA-B48
JESD-609 Code
e3
Length
8 mm
Memory Density
4194304 bit
Memory IC Type
FLASH
Memory Width
8
Number of Functions
1
Number of Terminals
48
Number of Words
524288 words
Number of Words Code
512000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Organization
512KX8
Package Body Material
PLASTIC/EPOXY
Package Code
TFBGA
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
260
Programming Voltage
3 V
Qualification Status
Not Qualified
Seated Height-Max
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
3 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
MILITARY
Terminal Finish
MATTE TIN
Terminal Form
BALL
Terminal Pitch
0.8 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Width
6 mm
Base Number Matches
1
2
ECCN Code
EAR99
HTS Code
8542.32.00.51
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