AM29LV200BT-70WAC vs AM29LV200BT-70WAD feature comparison

AM29LV200BT-70WAC Spansion

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AM29LV200BT-70WAD Spansion

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SPANSION INC SPANSION INC
Part Package Code BGA BGA
Package Description TFBGA, 6 X 8 MM, 0.80 MM PITCH, LEAD FREE, FBGA-48
Pin Count 48 48
Reach Compliance Code compliant compliant
Access Time-Max 70 ns 70 ns
Additional Feature TOP BOOT BLOCK TOP BOOT BLOCK
Alternate Memory Width 8 8
JESD-30 Code R-PBGA-B48 R-PBGA-B48
JESD-609 Code e0 e1
Length 8.15 mm 8.15 mm
Memory Density 2097152 bit 2097152 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 128KX16 128KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240 260
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 40
Width 6.15 mm 6.15 mm
Base Number Matches 2 2

Compare AM29LV200BT-70WAC with alternatives

Compare AM29LV200BT-70WAD with alternatives