Findchips: Compare AM29LV200BB-70DFC1 vs AM29LV200BB-70DRD

AM29LV200BB-70DFC1 vs AM29LV200BB-70DRD feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	SPANSION INC	SPANSION INC
Part Package Code	DIE	DIE
Package Description	DIE-43	DIE-43
Pin Count	43	43
Reach Compliance Code	unknown	compliant
ECCN Code	EAR99	EAR99
HTS Code	8542.32.00.51	8542.32.00.51
Access Time-Max	70 ns	70 ns
Additional Feature	BOTTOM BOOT BLOCK	BOTTOM BOOT BLOCK
Alternate Memory Width	8	8
Boot Block	BOTTOM	BOTTOM
JESD-30 Code	R-XUUC-N43	R-XUUC-N43
Memory Density	2097152 bit	2097152 bit
Memory IC Type	FLASH	FLASH
Memory Width	16	16
Number of Functions	1	1
Number of Terminals	43	43
Number of Words	131072 words	131072 words
Number of Words Code	128000	128000
Operating Mode	ASYNCHRONOUS	ASYNCHRONOUS
Operating Temperature-Max	70 °C	70 °C
Operating Temperature-Min
Organization	128KX16	128KX16
Package Body Material	UNSPECIFIED	UNSPECIFIED
Package Code	DIE	DIE
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	UNCASED CHIP	UNCASED CHIP
Parallel/Serial	PARALLEL	PARALLEL
Programming Voltage	3 V	3 V
Qualification Status	Not Qualified	Not Qualified
Supply Voltage-Max (Vsup)	3.6 V	3.6 V
Supply Voltage-Min (Vsup)	2.7 V	2.7 V
Supply Voltage-Nom (Vsup)	3 V	3 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	COMMERCIAL	COMMERCIAL
Terminal Form	NO LEAD	NO LEAD
Terminal Position	UPPER	UPPER
Type	NOR TYPE	NOR TYPE
Base Number Matches	1	1
Pbfree Code		Yes
Rohs Code		Yes
Peak Reflow Temperature (Cel)		260
Time@Peak Reflow Temperature-Max (s)		40
	Memory » Flash Memories	Memory » Flash Memories