AM29LV160BT120WCC vs AM29LV160BT120WCI feature comparison

AM29LV160BT120WCC Spansion

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AM29LV160BT120WCI Spansion

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SPANSION INC SPANSION INC
Part Package Code BGA BGA
Package Description TFBGA, 8 X 9 MM, 0.80 MM PITCH, FBGA-48
Pin Count 48 48
Reach Compliance Code compliant compliant
Access Time-Max 120 ns 120 ns
Additional Feature TOP BOOT BLOCK TOP BOOT BLOCK
Alternate Memory Width 8 8
JESD-30 Code R-PBGA-B48 R-PBGA-B48
JESD-609 Code e0 e0
Length 9 mm 9 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 1MX16 1MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240 240
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 8 mm 8 mm
Base Number Matches 2 2

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