AM29LV128MH103REI
vs
TE28F128P33T85
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
INTEL CORP
|
| Part Package Code |
TSOP1
|
TSOP
|
| Package Description |
MO-142B, TSOP-56
|
TSSOP, TSSOP56,.8,20
|
| Pin Count |
56
|
56
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Access Time-Max |
100 ns
|
85 ns
|
| Alternate Memory Width |
8
|
|
| Command User Interface |
YES
|
YES
|
| Common Flash Interface |
YES
|
YES
|
| Data Polling |
YES
|
NO
|
| JESD-30 Code |
R-PDSO-G56
|
R-PDSO-G56
|
| JESD-609 Code |
e0
|
|
| Length |
18.4 mm
|
18.4 mm
|
| Memory Density |
134217728 bit
|
134217728 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Sectors/Size |
256
|
4,127
|
| Number of Terminals |
56
|
56
|
| Number of Words |
8388608 words
|
8388608 words
|
| Number of Words Code |
8000000
|
8000000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
8MX16
|
8MX16
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSOP1
|
TSSOP
|
| Package Equivalence Code |
TSSOP56,.8,20
|
TSSOP56,.8,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Page Size |
4/8 words
|
4 words
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Programming Voltage |
3 V
|
3 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Ready/Busy |
YES
|
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Sector Size |
64K
|
16K,64K
|
| Standby Current-Max |
0.000005 A
|
0.000155 A
|
| Supply Current-Max |
0.08 mA
|
0.051 mA
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
2.3 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Toggle Bit |
YES
|
NO
|
| Type |
NOR TYPE
|
NOR TYPE
|
| Width |
14 mm
|
14 mm
|
| Base Number Matches |
1
|
1
|
| Additional Feature |
|
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
|
| Boot Block |
|
TOP
|
| Peak Reflow Temperature (Cel) |
|
225
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare AM29LV128MH103REI with alternatives
Compare TE28F128P33T85 with alternatives