AM29F800BT-90DWC2 vs AM29F800BB-90DGC2 feature comparison

AM29F800BT-90DWC2 AMD

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AM29F800BB-90DGC2 Spansion

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC SPANSION INC
Part Package Code WAFER DIE
Package Description DIE, DIE,
Pin Count 44 44
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 90 ns 90 ns
Additional Feature MIN 1000K WRITE CYCLES; 20 YEAR DATA RETENTION; TOP BOOT BLOCK MIN 1000K WRITE CYCLES; 20 YEAR DATA RETENTION; BOTTOM BOOT BLOCK
Alternate Memory Width 8 8
Boot Block TOP BOTTOM
Data Retention Time-Min 20 20
JESD-30 Code R-XUUC-N44 R-XUUC-N44
Memory Density 8388608 bit 8388608 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 44 44
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 512KX16 512KX16
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIE DIE
Package Shape RECTANGULAR RECTANGULAR
Package Style UNCASED CHIP UNCASED CHIP
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 5 V 5 V
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form NO LEAD NO LEAD
Terminal Position UPPER UPPER
Type NOR TYPE NOR TYPE
Base Number Matches 2 2
Rohs Code No
JESD-609 Code e0
Terminal Finish TIN LEAD

Compare AM29F800BT-90DWC2 with alternatives

Compare AM29F800BB-90DGC2 with alternatives