AM29F800BB-90DGC2
vs
AM29F800BT-90DWC2
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
SPANSION INC
ADVANCED MICRO DEVICES INC
Part Package Code
DIE
WAFER
Package Description
DIE,
DIE,
Pin Count
44
44
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
90 ns
90 ns
Additional Feature
MIN 1000K WRITE CYCLES; 20 YEAR DATA RETENTION; BOTTOM BOOT BLOCK
MIN 1000K WRITE CYCLES; 20 YEAR DATA RETENTION; TOP BOOT BLOCK
Alternate Memory Width
8
8
Boot Block
BOTTOM
TOP
Data Retention Time-Min
20
20
JESD-30 Code
R-XUUC-N44
R-XUUC-N44
JESD-609 Code
e0
Memory Density
8388608 bit
8388608 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
44
44
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
512KX16
512KX16
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIE
DIE
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
UNCASED CHIP
UNCASED CHIP
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
5 V
5 V
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
NO LEAD
NO LEAD
Terminal Position
UPPER
UPPER
Type
NOR TYPE
NOR TYPE
Base Number Matches
2
2
Compare AM29F800BB-90DGC2 with alternatives
Compare AM29F800BT-90DWC2 with alternatives