AM29F400BB-75DWF2 vs AM29F400BB-75DGE2 feature comparison

AM29F400BB-75DWF2 Spansion

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AM29F400BB-75DGE2 Spansion

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SPANSION INC SPANSION INC
Part Package Code WAFER DIE
Package Description WAFER-43 DIE, DIE OR CHIP
Pin Count 43 43
Reach Compliance Code compliant compliant
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 70 ns 70 ns
Additional Feature BOTTOM BOOT BLOCK BOTTOM BOOT BLOCK
Alternate Memory Width 8 8
Boot Block BOTTOM BOTTOM
JESD-30 Code R-XUUC-N43 R-XUUC-N43
Memory Density 4194304 bit 4194304 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 43 43
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 256KX16 256KX16
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIE DIE
Package Shape RECTANGULAR RECTANGULAR
Package Style UNCASED CHIP UNCASED CHIP
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Programming Voltage 5 V 5 V
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.25 V 5.25 V
Supply Voltage-Min (Vsup) 4.75 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form NO LEAD NO LEAD
Terminal Position UPPER UPPER
Time@Peak Reflow Temperature-Max (s) 40
Type NOR TYPE NOR TYPE
Base Number Matches 1 1
Command User Interface YES
Data Polling YES
Endurance 1000000 Write/Erase Cycles
JESD-609 Code e0
Number of Sectors/Size 1,2,1,7
Package Equivalence Code DIE OR CHIP
Ready/Busy YES
Sector Size 16K,8K,32K,64K
Terminal Finish TIN LEAD
Toggle Bit YES

Compare AM29F400BB-75DWF2 with alternatives

Compare AM29F400BB-75DGE2 with alternatives