AM29F400BB-75DWF2 vs AM29F400BB-70FK feature comparison

AM29F400BB-75DWF2 Spansion

Buy Now Datasheet

AM29F400BB-70FK Spansion

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SPANSION INC SPANSION INC
Part Package Code WAFER TSOP1
Package Description WAFER-43 REVERSE, MO-142BDD, TSOP-48
Pin Count 43 48
Reach Compliance Code compliant compliant
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 70 ns 70 ns
Additional Feature BOTTOM BOOT BLOCK BOTTOM BOOT BLOCK
Alternate Memory Width 8 8
Boot Block BOTTOM BOTTOM
JESD-30 Code R-XUUC-N43 R-PDSO-G48
Memory Density 4194304 bit 4194304 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 43 48
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 256KX16 256KX16
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIE TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style UNCASED CHIP SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Programming Voltage 5 V 5 V
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.25 V 5.5 V
Supply Voltage-Min (Vsup) 4.75 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form NO LEAD GULL WING
Terminal Position UPPER DUAL
Time@Peak Reflow Temperature-Max (s) 40
Type NOR TYPE NOR TYPE
Base Number Matches 1 2
Pbfree Code Yes
JESD-609 Code e3
Length 18.4 mm
Moisture Sensitivity Level 3
Seated Height-Max 1.2 mm
Terminal Finish MATTE TIN
Terminal Pitch 0.5 mm
Width 12 mm

Compare AM29F400BB-75DWF2 with alternatives

Compare AM29F400BB-70FK with alternatives