AM29F200BT-90DWH1
vs
AM29F200BT-90DGH1
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SPANSION INC
|
SPANSION INC
|
| Package Description |
DIE,
|
DIE,
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A001.A.2.A
|
3A001.A.2.A
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Access Time-Max |
90 ns
|
90 ns
|
| Additional Feature |
CONFIGURABLE AS 128K X 16; EMBEDDED ALGORITHMS; 20 YEARS DATA RETENTION
|
CONFIGURABLE AS 128K X 16; EMBEDDED ALGORITHMS; 20 YEARS DATA RETENTION
|
| Boot Block |
TOP
|
TOP
|
| Data Retention Time-Min |
20
|
20
|
| JESD-30 Code |
X-XUUC-N42
|
X-XUUC-N42
|
| Memory Density |
2097152 bit
|
2097152 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
42
|
42
|
| Number of Words |
262144 words
|
262144 words
|
| Number of Words Code |
256000
|
256000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
140 °C
|
140 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Organization |
256KX8
|
256KX8
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
DIE
|
DIE
|
| Package Shape |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Style |
UNCASED CHIP
|
UNCASED CHIP
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Programming Voltage |
5 V
|
5 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Position |
UPPER
|
UPPER
|
| Type |
NOR TYPE
|
NOR TYPE
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare AM29F200BT-90DWH1 with alternatives
Compare AM29F200BT-90DGH1 with alternatives