AM29F200BT-55WJC1
vs
AM29F200BT-90DWC1
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SPANSION INC
SPANSION INC
Part Package Code
DIE
WAFER
Package Description
DIE-42
WAFER-42
Pin Count
42
42
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
55 ns
90 ns
Additional Feature
TOP BOOT BLOCK
TOP BOOT BLOCK
Alternate Memory Width
8
8
Boot Block
TOP
TOP
JESD-30 Code
R-XUUC-N42
R-XUUC-N42
JESD-609 Code
e0
e0
Memory Density
2097152 bit
2097152 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
42
42
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
128KX16
128KX16
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIE
DIE
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
UNCASED CHIP
UNCASED CHIP
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
5 V
5 V
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
NO LEAD
NO LEAD
Terminal Position
UPPER
UPPER
Type
NOR TYPE
NOR TYPE
Base Number Matches
2
3
Command User Interface
YES
Data Polling
YES
Endurance
1000000 Write/Erase Cycles
Moisture Sensitivity Level
3
Number of Sectors/Size
1,2,1,3
Package Equivalence Code
DIE OR CHIP
Peak Reflow Temperature (Cel)
260
Ready/Busy
YES
Sector Size
16K,8K,32K,64K
Toggle Bit
YES
Compare AM29F200BT-55WJC1 with alternatives
Compare AM29F200BT-90DWC1 with alternatives