AM29F200BT-55WJC1
vs
AM29F200BT-55WJD1
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
SPANSION INC
Part Package Code
WAFER
DIE
Package Description
WAFER-42
DIE-42
Pin Count
42
42
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
55 ns
55 ns
Alternate Memory Width
8
8
Boot Block
TOP
TOP
JESD-30 Code
R-XUUC-N42
R-XUUC-N42
Memory Density
2097152 bit
2097152 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
42
42
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
128KX16
128KX16
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIE
DIE
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
UNCASED CHIP
UNCASED CHIP
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
5 V
5 V
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.25 V
5.5 V
Supply Voltage-Min (Vsup)
4.75 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Position
UPPER
UPPER
Type
NOR TYPE
NOR TYPE
Base Number Matches
2
1
Rohs Code
Additional Feature
TOP BOOT BLOCK
JESD-609 Code
e3
Terminal Finish
MATTE TIN
Compare AM29F200BT-55WJC1 with alternatives
Compare AM29F200BT-55WJD1 with alternatives