AM29F200BB55SI
vs
AM29F200BT55SC
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
SPANSION INC
|
ADVANCED MICRO DEVICES INC
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
SOP,
|
SOP-44
|
| Pin Count |
44
|
44
|
| Reach Compliance Code |
compliant
|
unknown
|
| Access Time-Max |
55 ns
|
55 ns
|
| Additional Feature |
CONFG AS 128K X 16; BOTTOM BOOT BLOCK
|
CONFG AS 128K X 16; TOP BOOT BLOCK
|
| JESD-30 Code |
R-PDSO-G44
|
R-PDSO-G44
|
| JESD-609 Code |
e0
|
|
| Memory Density |
2097152 bit
|
2097152 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
8
|
8
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
44
|
44
|
| Number of Words |
262144 words
|
262144 words
|
| Number of Words Code |
256000
|
256000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
256KX8
|
256KX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
240
|
|
| Programming Voltage |
5 V
|
5 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare AM29F200BB55SI with alternatives
Compare AM29F200BT55SC with alternatives