AM29F032B150SD vs UPD23C32000ALGX-XXX-A feature comparison

AM29F032B150SD Spansion

Buy Now Datasheet

UPD23C32000ALGX-XXX-A Renesas Electronics Corporation

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SPANSION INC RENESAS ELECTRONICS CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP,
Pin Count 44 44
Reach Compliance Code compliant unknown
Access Time-Max 150 ns 150 ns
JESD-30 Code R-PDSO-G44 R-PDSO-G44
JESD-609 Code e3 e3/e6
Memory Density 33554432 bit 33554432 bit
Memory IC Type FLASH MASK ROM
Memory Width 8 16
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 44 44
Number of Words 4194304 words 2097152 words
Number of Words Code 4000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min -10 °C
Organization 4MX8 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 260
Programming Voltage 5 V
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 4.5 V 2.7 V
Supply Voltage-Nom (Vsup) 5 V 3 V
Surface Mount YES YES
Technology CMOS MOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish MATTE TIN MATTE TIN/TIN BISMUTH
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40 10
Base Number Matches 3 1
ECCN Code EAR99
HTS Code 8542.32.00.71
Alternate Memory Width 8
Length 27.83 mm
Seated Height-Max 3 mm
Supply Current-Max 0.04 mA
Terminal Pitch 1.27 mm
Width 13.24 mm

Compare AM29F032B150SD with alternatives

Compare UPD23C32000ALGX-XXX-A with alternatives